Fine Cut Pad Case - Durable & Protective Storage for Electronic Devices - Perfect for Travel, Work, and Daily Use

Product Description

Koch-Chemie's Fine Cut Pad is a medium abrasive sponge for removing moderate weathering and scratches using Koch-Chemie's Fine Cut F6.01 Polishing Compound. The short height of 23mm creates low torsion forces, very good handling and the highest level of stability. The special density of the foam material enables long-lasting compression hardness during polishing. The optimized reticulation (open cellular structure) and cell count contributes to a high level of abrasiveness and excellent hygiene factors. The milling edge ensures extra flexibility for the pads, enabling them to fit around contours easier. The colorful non-woven material, suitable for polishing, ensures process safety.

COMPRESSION HARDNESS: 12
ABRASIVENESS: 5